Ceramic Small Outline Packages

Material properties process flow. Up u down d 1st 2nd 3rd total pitch stand off height seal ring. Material in laminated ceramic packages.

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Ceramic small outline packages.

Mm lead count cavity overall layer thickness lead ntk material code b black w white connection 0 non conect drawing no. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Ceramic packages for large scale integration lsi devices. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.

Ceramic substrates for probe cards. Lead count cavity overall layer t hic kness total 0084 0085 0085 0085 lead nt k mat erial code ring connection drawing no o non co ne ct attach. Standard packages and lids for device evaluation. Ceramic small outline package csop national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.

Also used as a structural material in ceramic. Copper cu a copper alloy a copper nickel tin alloy is used as the lead frame material in plastic packages. Ceramic small outline packages offer a readily available surface mount alternative to plastic surface packages. Csop ceramic small outline packages mm inch unit.

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