Ceramic Substrate Thermal Conductivity

Aln is a widely used ceramic in thermal management components with a thermal conductivity of approximately 180 w mk.

Ceramic substrate thermal conductivity.

September 1 1999 clemens j. Aluminum nitride an216a 150. Lasance articles design materials compounds adhesives substrates test measurement ceramics technical data thermal conductivity ceramics are increasingly used in packages and printed circuit boards because they have a number of advantages over plastics. Silicon carbide sc1000 200.

Direct bonded copper dbc substrates are commonly used in power modules because of their very good thermal conductivity they are composed of a ceramic tile commonly alumina with a sheet of copper bonded to one or both sides by a high temperature oxidation process the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm. Information of silicon carbide. The thermal conductivity of ceramic materials plays an important role in its application. Science and technology 2001.

Ceramics with high or low thermal conductivity can be selected from our materials list. In a certain range increasing the thermal conductivity of ceramic materials by specific methods will improve its ability of heat conduction heat convection and heat radiation so as to further expand its application field. It can be produced through a variety of manufacturing methods but it is most commonly available in tape cast substrate form approximately 1mm thick.