Ceramic Substrates And Packages For Electronic Applications

Kyocera ecu substrates provide high density circuit design high temperature durability good heat dissipation and high reliability with multilayer ceramics.

Ceramic substrates and packages for electronic applications.

Over 150 us companies produce or supply electronic ceramics. Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al. At the same time the vacuum tight housings and substrates must. The insulating properties of ceramics are well known and these properties have found application in advanced ceramic materials for substrates and packages.

Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance. Htcc high temperature co fired ceramics alumina system and ltcc low temperature co fired ceramics glass ceramic system are available. The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes it suitable for a number of thin film applications sputtering. This ceramic material is characterized by its extremely high strength and thermal conductivity.

Rubalit 708 s with 96 al 2 o 3. The materials and products are described in this article. Printed resistors and high current capacity trough conductive line structures are also available.