Ceramic Wafer Chuck

When the wafer is held on the chuck it elastically deforms to the chuck s conic shape thus ensuring that the grinding wheel only contacts half of the wafer at any given instant.

Ceramic wafer chuck.

The wafer chuck ensures accurate positioning of the wafer in various process steps. With applications for the semiconductor industry ever diversifying so are the substrate and materials used to provide new products. With our unique know how of ceramic industry and years immersing in semi conductor industry werlchem llc is at the forefront in the development of materials and components for the demanding environments of semiconductor processing such as chuck table wafer carriers cmp grinding and polishing chucks end effectors etc. By using ceramic materials flatnesses of less than 1 micron can be achieved.

We are providing below ceramic chuck table products services new and refurbished porous ceramic chucks for disco adt k s applied materials tsk okamoto micro automation load point etc dicing saws and grinders 4 5 6 8 12 regular size available in round square oval shape or irregular shapes and sizes high precision of surface flatness of 2 micron custom chucks for dicing. Our wafer chuck tables electrostatic chucks and heaters are virtually found in many semiconductor equipment in most of. The chuck has a pore size of less than 25 microns 60 microns optional assuring uniform suction and strong holding power for even the smallest parts. Photomachining offers a variety of porous vacuum chuck designs for use with thin films semiconductor wafers and other flat samples.

The shape of the ceramic chuck can be dressed to a conic shape with a very small angle see fig. Arc also manufactures custom chucks from a customer s drawing or solid model. Heat transfer between the chuck and the wafer may be con sidered as the combination of contact point conduction heat. Arc will design a wafer chuck to a customer s unique requirements and quote the finished product.

Shown on the right is a 6 inch diameter free standing porous ceramic chuck plate with pores size 20um 10. The chuck plate plays an integral part in supporting the wafer throughout processing not just to accurately position the wafer during testing. Pared with ceramic the electrostatic force is 1 10 smaller and. Advanced ceramic vacuum wafer chucks materials developed specifically for wafer handling as a leader in technical ceramics for wafer processing equipment coorstek understands advanced semiconductor manufacturing and constantly develops new materials designs and processes to optimize yields and extend product life.